Executive Briefings

Innovative Packaging to Protect Intel's Product Line

John Biggs, Intel mechanical engineer, explains why the company stopped using plastic injection molded trays to ship sophisticated product in favor of low-tech thermoformed trays -- and saved a bundle. [Run Time (Min.): 8:57]

John Biggs, Intel mechanical engineer, explains why the company stopped using plastic injection molded trays to ship sophisticated product in favor of low-tech thermoformed trays -- and saved a bundle. [Run Time (Min.): 8:57]